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LW-XH250S-XX-X 2.5mm Pitch Single Row Wafer, 180° DIP
Specifications
- Current Rating: 3A AC, DC
- Voltage Rating: 250V AC Maximum
- Operating Temp: -25°C ~ +85°C
- Contact Resistance: 10mΩ Max
- Insulation Resistance: 1000MΩ Min
- Withstanding voltage: 1000V AC / minute
- Terminal Material: Brass / Gold Flash
- Material: Nylon 6T, UL94V-0
- Solder Tab: Brass / Tin Plated
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LW-XH250R-XX-X 2.5mm Pitch Single Row Wafer , 90° DIP
Specifications
- Current Rating: 3A AC, DC
- Voltage Rating: 250V AC Maximum
- Operating Temp: -25°C ~ +85°C
- Contact Resistance: 10mΩ Max
- Insulation Resistance: 1000MΩ Min
- Withstanding voltage: 1000V AC / minute
- Terminal Material: Brass / Tin-plated
- Material: Nylon 66, UL94V-0,Natural
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LW-XH250R-XXGO-S 2.5mm Pitch Single Row Wafer , 90° SMT
Specifications
- Current Rating: 3A AC, DC
- Voltage Rating: 250V AC Maximum
- Operating Temp: -25°C ~ +85°C
- Contact Resistance: 10mΩ Max
- Insulation Resistance: 1000MΩ Min
- Withstanding voltage: 1000V AC / minute
- Terminal Material: Brass / Gold Flash
- Material: Nylon 6T, UL94V-0
- Solder Tab: Brass / Tin Plated
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LH-XH250-XX 2.5mm Pitch Single Row Crimp Terminal Housing
Specifications
- Current rating : 3A AC,DC
- Voltage rating : 250V AC,DC
- Temperature range : -25°C to +85 °C
- Conctact resistance : 10mΩ Max.
- Insulation resistance : 1000MΩ Min.
- Withstanding voltage : 800V AC/minute
- Material : Nylon 66, UL94V-0
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LT-XH2501-PS 2.5mm Pitch Wire-to-Board Terminal
共計 5 項